EFFECT OF INTERFACE CHEMICAL COMPOSITION ON THE HIGH STRAIN RATE DEPENDENT MECHANICAL BEHAVIOR OF AN ENERGETIC MATERIAL
thesisposted on 04.01.2019 by Chandra Prakash
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A combined experimental and computational study has been performed in order to understand the effect of interface chemical composition on the shock induced mechanical behavior of an energetic material (EM) system consisting of Hydroxyl-Terminated Polybutadiene (HTPB) binder and an oxidizer, Ammonium Perchlorate (AP), particle embedded in the binder. The current study focuses on the effect of interface chemical composition between the HTPB binder material and the AP particles on the high strain rate mechanical behavior. The HTPB-AP interface chemical composition was changed by adding cyanoethylated polyamine (HX-878 or Tepanol) as a binding agent. A power law viscoplastic constitutive model was fitted to nanoscale impact based experimental stress-strain-strain rate data in order to obtain the constitutive behavior of the HTPBAP interfaces, AP particle, and HTPB binder matrix. An in-situ mechanical Raman spectroscopy framework was used to analyze the effect of binding agent on cohesive separation properties of the HTPB-AP interfaces, AP particle, and HTPB binder matrix. In addition, a combined mechanical Raman spectroscopy and laser impact set up was used to study the effect of strain rate, as well as the interface chemical composition on the interface shock viscosity. Finally, high velocity strain rate impact simulations were performed using an explicit cohesive finite element method framework to predict the effect of strain rate, interface strength, interface friction, and interface shock viscosity on possible strain rate dependent temperature rises at high strain rates approaching shock velocities.
A modified stress equation was used in the cohesive finite element framework in order to include the effect of shock viscosity on the shock wave rise time and shock pressure during impact loading with strain rates corresponding to shock impact velocities. It is shown that increasing the interface shock viscosity, which can be altered by changing the interface chemical composition, increases the shock wave rise time at the analyzed interfaces. It is shown that the interface shock viscosity also plays an important role in determining the temperature increase within the microstructure. Interface shock viscosity leads to a decrease in the overall density of the possible hot-spots which is caused by the increase in dissipation at the shock front. This increase in shock dissipation is accompanied by a decrease in the both the maximum temperature, as well as the plastic dissipation energy, within the microstructure during shock loading.